<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Zhu H</submitter><funding>U.S. Department of Energy</funding><funding>United States Department of Defense | United States Navy | Office of Naval Research</funding><funding>United States Department of Defense | Defense Advanced Research Projects Agency (DARPA)</funding><funding>U.S. Department of Energy (DOE)</funding><funding>United States Department of Defense | Defense Advanced Research Projects Agency</funding><funding>United States Department of Defense | United States Navy | Office of Naval Research (ONR)</funding><pagination>3300</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC10244423</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>14(1)</volume><pubmed_abstract>To achieve optimal thermoelectric performance, it is crucial to manipulate the scattering processes within materials to decouple the transport of phonons and electrons. In half-Heusler (hH) compounds, selective defect reduction can significantly improve performance due to the weak electron-acoustic phonon interaction. This study utilized Sb-pressure controlled annealing process to modulate the microstructure and point defects of Nb&lt;sub>0.55&lt;/sub>Ta&lt;sub>0.40&lt;/sub>Ti&lt;sub>0.05&lt;/sub>FeSb compound, resulting in a 100% increase in carrier mobility and a maximum power factor of 78 µW cm&lt;sup>-1&lt;/sup> K&lt;sup>-2&lt;/sup>, approaching the theoretical prediction for NbFeSb single crystal. This approach yielded the highest average zT of ~0.86 among hH in the temperature range of 300-873 K. The use of this material led to a 210% enhancement in cooling power density compared to Bi&lt;sub>2&lt;/sub>Te&lt;sub>3&lt;/sub>-based devices and a conversion efficiency of 12%. These results demonstrate a promising strategy for optimizing hH materials for near-room-temperature thermoelectric applications.</pubmed_abstract><journal>Nature communications</journal><pubmed_title>Half-Heusler alloys as emerging high power density thermoelectric cooling materials.</pubmed_title><pmcid>PMC10244423</pmcid><funding_grant_id>N00014-20-1-2602</funding_grant_id><funding_grant_id>NETS</funding_grant_id><funding_grant_id>DE-SC0021118</funding_grant_id><pubmed_authors>Li W</pubmed_authors><pubmed_authors>Liu N</pubmed_authors><pubmed_authors>Zhang Y</pubmed_authors><pubmed_authors>Priya S</pubmed_authors><pubmed_authors>Zhu H</pubmed_authors><pubmed_authors>Poudel B</pubmed_authors><pubmed_authors>Nozariasbmarz A</pubmed_authors></additional><is_claimable>false</is_claimable><name>Half-Heusler alloys as emerging high power density thermoelectric cooling materials.</name><description>To achieve optimal thermoelectric performance, it is crucial to manipulate the scattering processes within materials to decouple the transport of phonons and electrons. In half-Heusler (hH) compounds, selective defect reduction can significantly improve performance due to the weak electron-acoustic phonon interaction. This study utilized Sb-pressure controlled annealing process to modulate the microstructure and point defects of Nb&lt;sub>0.55&lt;/sub>Ta&lt;sub>0.40&lt;/sub>Ti&lt;sub>0.05&lt;/sub>FeSb compound, resulting in a 100% increase in carrier mobility and a maximum power factor of 78 µW cm&lt;sup>-1&lt;/sup> K&lt;sup>-2&lt;/sup>, approaching the theoretical prediction for NbFeSb single crystal. This approach yielded the highest average zT of ~0.86 among hH in the temperature range of 300-873 K. The use of this material led to a 210% enhancement in cooling power density compared to Bi&lt;sub>2&lt;/sub>Te&lt;sub>3&lt;/sub>-based devices and a conversion efficiency of 12%. These results demonstrate a promising strategy for optimizing hH materials for near-room-temperature thermoelectric applications.</description><dates><release>2023-01-01T00:00:00Z</release><publication>2023 Jun</publication><modification>2025-04-19T08:10:46.368Z</modification><creation>2025-04-19T08:10:46.368Z</creation></dates><accession>S-EPMC10244423</accession><cross_references><pubmed>37280195</pubmed><doi>10.1038/s41467-023-38446-0</doi></cross_references></HashMap>