<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Li Q</submitter><funding>National Science Foundation of China | National Natural Science Foundation of China-Yunnan Joint Fund (NSFC-Yunnan Joint Fund)</funding><funding>China Postdoctoral Science Foundation</funding><funding>Science and Technology Commission of Shanghai Municipality (Shanghai Municipal Science and Technology Commission)</funding><pagination>2686</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC10973520</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>15(1)</volume><pubmed_abstract>With the development of wearable devices and hafnium-based ferroelectrics (FE), there is an increasing demand for high-performance flexible ferroelectric memories. However, developing ferroelectric memories that simultaneously exhibit good flexibility and significant performance has proven challenging. Here, we developed a high-performance flexible field-effect transistor (FeFET) device with a thermal budget of less than 400 °C by integrating Zr-doped HfO&lt;sub>2&lt;/sub> (HZO) and ultra-thin indium tin oxide (ITO). The proposed FeFET has a large memory window (MW) of 2.78 V, a high current on/off ratio (I&lt;sub>ON&lt;/sub>/I&lt;sub>OFF&lt;/sub>) of over 10&lt;sup>8&lt;/sup>, and high endurance up to 2×10&lt;sup>7&lt;/sup> cycles. In addition, the FeFETs under different bending conditions exhibit excellent neuromorph</pubmed_abstract><journal>Nature communications</journal><pubmed_title>High-performance ferroelectric field-effect transistors with ultra-thin indium tin oxide channels for flexible and transparent electronics.</pubmed_title><pmcid>PMC10973520</pmcid><funding_grant_id>22175042</funding_grant_id><funding_grant_id>BX2021070</funding_grant_id><funding_grant_id>22501100900</funding_grant_id><pubmed_authors>Liu Y</pubmed_authors><pubmed_authors>Zhang DW</pubmed_authors><pubmed_authors>Li Z</pubmed_authors><pubmed_authors>Yang Y</pubmed_authors><pubmed_authors>Sun Q</pubmed_authors><pubmed_authors>Wang S</pubmed_authors><pubmed_authors>Hu X</pubmed_authors><pubmed_authors>Wang T</pubmed_authors><pubmed_authors>Chen L</pubmed_authors><pubmed_authors>Li Q</pubmed_authors><pubmed_authors>Yu J</pubmed_authors><pubmed_authors>Meng J</pubmed_authors></additional><is_claimable>false</is_claimable><name>High-performance ferroelectric field-effect transistors with ultra-thin indium tin oxide channels for flexible and transparent electronics.</name><description>With the development of wearable devices and hafnium-based ferroelectrics (FE), there is an increasing demand for high-performance flexible ferroelectric memories. However, developing ferroelectric memories that simultaneously exhibit good flexibility and significant performance has proven challenging. Here, we developed a high-performance flexible field-effect transistor (FeFET) device with a thermal budget of less than 400 °C by integrating Zr-doped HfO&lt;sub>2&lt;/sub> (HZO) and ultra-thin indium tin oxide (ITO). The proposed FeFET has a large memory window (MW) of 2.78 V, a high current on/off ratio (I&lt;sub>ON&lt;/sub>/I&lt;sub>OFF&lt;/sub>) of over 10&lt;sup>8&lt;/sup>, and high endurance up to 2×10&lt;sup>7&lt;/sup> cycles. In addition, the FeFETs under different bending conditions exhibit excellent neuromorph</description><dates><release>2024-01-01T00:00:00Z</release><publication>2024 Mar</publication><modification>2025-04-26T11:26:29.997Z</modification><creation>2025-04-06T13:39:52.221Z</creation></dates><accession>S-EPMC10973520</accession><cross_references><pubmed>38538586</pubmed><doi>10.1038/s41467-024-46878-5</doi></cross_references></HashMap>