{"database":"biostudies-literature","file_versions":[],"scores":null,"additional":{"submitter":["Cheng R"],"funding":["DOE | Advanced Research Projects Agency - Energy (Advanced Research Projects Agency - Energy - U.S. Department of Energy)","National Science Foundation (NSF)"],"pagination":["794"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC11742011"],"repository":["biostudies-literature"],"omics_type":["Unknown"],"volume":["16(1)"],"pubmed_abstract":["Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance <1 mm² K W<sup>-1</sup> at interface, outperforming state-of-the-art thermal interface materials on chip-cooling. The high reliability of the nanostructured composites enables undegraded performance through extreme temperature cycling. We envision liquid-infused nanostructured composites as a universal thermal interface solution for cooling applications in data centers, GPU/CPU systems, solid-state lasers, and LEDs."],"journal":["Nature communications"],"pubmed_title":["Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling."],"pmcid":["PMC11742011"],"funding_grant_id":["No. TIP-2414733","No. DE-AR0001761"],"pubmed_authors":["Salihoglu H","Jing L","Zhong Y","Russell L","Garcia-Caraveo AV","Liu X","Li Z","Huang T","Wang Q","Cheng R","Kazem N","Shen S","Luo X","Yun HS","Wang Z","Chen T"],"additional_accession":[]},"is_claimable":false,"name":"Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling.","description":"Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance <1 mm² K W<sup>-1</sup> at interface, outperforming state-of-the-art thermal interface materials on chip-cooling. The high reliability of the nanostructured composites enables undegraded performance through extreme temperature cycling. We envision liquid-infused nanostructured composites as a universal thermal interface solution for cooling applications in data centers, GPU/CPU systems, solid-state lasers, and LEDs.","dates":{"release":"2025-01-01T00:00:00Z","publication":"2025 Jan","modification":"2025-04-25T18:44:53.471Z","creation":"2025-04-06T07:43:13.348Z"},"accession":"S-EPMC11742011","cross_references":{"pubmed":["39824798"],"doi":["10.1038/s41467-025-56163-8"]}}