<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Bhusari R</submitter><funding>Fonds National de la Recherche</funding><pagination>3316</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC12298920</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>18(14)</volume><pubmed_abstract>Double ultrathin copper foils (DTH), widely used for producing conductive tracks in electronics, consist of an ultrathin copper functional foil (FF), a nanometric release layer (RL), and an ultrathin copper carrier foil (CF). Achieving stable release strength of the CF during DTH lamination remains a key challenge, largely due to limited knowledge about the structure of the RL. In this study, a comprehensive characterization methodology is proposed to investigate the physico-chemical structure of a chromium-based RL, both before and after thermal exposure at 230 °C. Peel-off testing, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and transmission electron microscopy (TEM) were employed. The main structural transformation identified is the oxidation of the RL at the </pubmed_abstract><journal>Materials (Basel, Switzerland)</journal><pubmed_title>Method for Elucidating the Structural Evolution of a Nanoscale Release Layer in Double Copper Foils Under Thermal Exposure.</pubmed_title><pmcid>PMC12298920</pmcid><funding_grant_id>2021/MS/16735209</funding_grant_id><pubmed_authors>Philippe AM</pubmed_authors><pubmed_authors>Kaidi Z</pubmed_authors><pubmed_authors>Bhusari R</pubmed_authors><pubmed_authors>Scholzen S</pubmed_authors><pubmed_authors>Addiego F</pubmed_authors><pubmed_authors>Bardon J</pubmed_authors><pubmed_authors>Guillot J</pubmed_authors></additional><is_claimable>false</is_claimable><name>Method for Elucidating the Structural Evolution of a Nanoscale Release Layer in Double Copper Foils Under Thermal Exposure.</name><description>Double ultrathin copper foils (DTH), widely used for producing conductive tracks in electronics, consist of an ultrathin copper functional foil (FF), a nanometric release layer (RL), and an ultrathin copper carrier foil (CF). Achieving stable release strength of the CF during DTH lamination remains a key challenge, largely due to limited knowledge about the structure of the RL. In this study, a comprehensive characterization methodology is proposed to investigate the physico-chemical structure of a chromium-based RL, both before and after thermal exposure at 230 °C. Peel-off testing, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and transmission electron microscopy (TEM) were employed. The main structural transformation identified is the oxidation of the RL at the </description><dates><release>2025-01-01T00:00:00Z</release><publication>2025 Jul</publication><modification>2025-08-27T03:06:46.407Z</modification><creation>2025-08-27T03:06:46.407Z</creation></dates><accession>S-EPMC12298920</accession><cross_references><pubmed>40731526</pubmed><doi>10.3390/ma18143316</doi></cross_references></HashMap>