{"database":"biostudies-literature","file_versions":[],"scores":null,"additional":{"omics_type":["Unknown"],"volume":["15(1)"],"submitter":["Lee YF"],"pubmed_abstract":["Cu-Cu direct bonding using electroplated ultrafine-grain Cu (107.24 nm) was studied in air at 110-150 °C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125 °C, the Σ3 boundary length exceeded 40%, while below 120 °C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature-time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190 s as temperature increased."],"journal":["Scientific reports"],"pagination":["30978"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC12373834"],"repository":["biostudies-literature"],"pubmed_title":["Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu."],"pmcid":["PMC12373834"],"pubmed_authors":["Chen PY","Cheng TY","Huang YC","Lin KC","Huang WC","Chang JS","Lee YF","Su YC","Lin CL","Chiu CY","Liu CY","Chiu CW","Yang LH","Hsieh HC","Yu ZY","Lo MH","Pan SA","Lin CH","Hsu CE"],"additional_accession":[]},"is_claimable":false,"name":"Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu.","description":"Cu-Cu direct bonding using electroplated ultrafine-grain Cu (107.24 nm) was studied in air at 110-150 °C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125 °C, the Σ3 boundary length exceeded 40%, while below 120 °C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature-time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190 s as temperature increased.","dates":{"release":"2025-01-01T00:00:00Z","publication":"2025 Aug","modification":"2026-05-03T03:08:40.308Z","creation":"2026-05-03T03:06:00.253Z"},"accession":"S-EPMC12373834","cross_references":{"pubmed":["40847129"],"doi":["10.1038/s41598-025-17058-2"]}}