<HashMap><database>biostudies-literature</database><scores/><additional><omics_type>Unknown</omics_type><volume>16(1)</volume><submitter>Blatter T</submitter><pubmed_abstract>A promising approach to increase wireless capacity is the transition to sub-Terahertz carrier frequencies (0.1-0.3 THz). While traditional high-frequency approaches employ III-V semiconductor technologies, plasmonics is emerging as a potential solution for highest-speed components. In this paper, we introduce an all-plasmonic sub-THz wireless link, utilizing compact (&lt;50 µm²) plasmonic components that exhibit a flat frequency response up to 300 GHz while providing full flexibility in carrier frequency selection. The plasmonic approach offers unprecedented integration potential, compatibility with diverse platforms, and scalable, cost-effective fabrication. To demonstrate its capabilities, we conduct a lab experiment transmitting 120 Gbit/s on a 285 GHz carrier across a 5 m free-space link,</pubmed_abstract><journal>Nature communications</journal><pagination>9988</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC12615664</full_dataset_link><repository>biostudies-literature</repository><pubmed_title>All-plasmonic sub-terahertz wireless communication link.</pubmed_title><pmcid>PMC12615664</pmcid><pubmed_authors>Destraz M</pubmed_authors><pubmed_authors>Leuthold J</pubmed_authors><pubmed_authors>Hess S</pubmed_authors><pubmed_authors>Horst Y</pubmed_authors><pubmed_authors>Smajic J</pubmed_authors><pubmed_authors>Zuerrer A</pubmed_authors><pubmed_authors>Fedoryshyn Y</pubmed_authors><pubmed_authors>Koepfli SM</pubmed_authors><pubmed_authors>Kulmer L</pubmed_authors><pubmed_authors>Blatter T</pubmed_authors><pubmed_authors>Rieben D</pubmed_authors><pubmed_authors>Baumann M</pubmed_authors></additional><is_claimable>false</is_claimable><name>All-plasmonic sub-terahertz wireless communication link.</name><description>A promising approach to increase wireless capacity is the transition to sub-Terahertz carrier frequencies (0.1-0.3 THz). While traditional high-frequency approaches employ III-V semiconductor technologies, plasmonics is emerging as a potential solution for highest-speed components. In this paper, we introduce an all-plasmonic sub-THz wireless link, utilizing compact (&lt;50 µm²) plasmonic components that exhibit a flat frequency response up to 300 GHz while providing full flexibility in carrier frequency selection. The plasmonic approach offers unprecedented integration potential, compatibility with diverse platforms, and scalable, cost-effective fabrication. To demonstrate its capabilities, we conduct a lab experiment transmitting 120 Gbit/s on a 285 GHz carrier across a 5 m free-space link,</description><dates><release>2025-01-01T00:00:00Z</release><publication>2025 Nov</publication><modification>2026-06-05T14:28:32.72Z</modification><creation>2026-05-17T03:13:32.969Z</creation></dates><accession>S-EPMC12615664</accession><cross_references><pubmed>41233334</pubmed><doi>10.1038/s41467-025-64926-6</doi></cross_references></HashMap>