{"database":"biostudies-literature","file_versions":[],"scores":null,"additional":{"submitter":["Hou L"],"funding":["European Research Council"],"pagination":["14862"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC6795889"],"repository":["biostudies-literature"],"omics_type":["Unknown"],"volume":["9(1)"],"pubmed_abstract":["This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn<sub>3</sub> phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu<sub>6</sub>Sn<sub>5</sub> phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the inter"],"journal":["Scientific reports"],"pubmed_title":["Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering."],"pmcid":["PMC6795889"],"funding_grant_id":["n° 714754"],"pubmed_authors":["Hou L","Beyne E","Moelans N","Derakhshandeh J","De Wolf I"],"additional_accession":[]},"is_claimable":false,"name":"Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.","description":"This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn<sub>3</sub> phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu<sub>6</sub>Sn<sub>5</sub> phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the inter","dates":{"release":"2019-01-01T00:00:00Z","publication":"2019 Oct","modification":"2025-04-26T16:42:50.374Z","creation":"2019-11-05T08:06:53Z"},"accession":"S-EPMC6795889","cross_references":{"pubmed":["31619710"],"doi":["10.1038/s41598-019-51179-9"]}}