<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Hou L</submitter><funding>European Research Council</funding><pagination>14862</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC6795889</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>9(1)</volume><pubmed_abstract>This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn&lt;sub>3&lt;/sub> phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu&lt;sub>6&lt;/sub>Sn&lt;sub>5&lt;/sub> phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the inter</pubmed_abstract><journal>Scientific reports</journal><pubmed_title>Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.</pubmed_title><pmcid>PMC6795889</pmcid><funding_grant_id>n° 714754</funding_grant_id><pubmed_authors>Hou L</pubmed_authors><pubmed_authors>Beyne E</pubmed_authors><pubmed_authors>Moelans N</pubmed_authors><pubmed_authors>Derakhshandeh J</pubmed_authors><pubmed_authors>De Wolf I</pubmed_authors></additional><is_claimable>false</is_claimable><name>Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.</name><description>This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn&lt;sub>3&lt;/sub> phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu&lt;sub>6&lt;/sub>Sn&lt;sub>5&lt;/sub> phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the inter</description><dates><release>2019-01-01T00:00:00Z</release><publication>2019 Oct</publication><modification>2025-04-26T16:42:50.374Z</modification><creation>2019-11-05T08:06:53Z</creation></dates><accession>S-EPMC6795889</accession><cross_references><pubmed>31619710</pubmed><doi>10.1038/s41598-019-51179-9</doi></cross_references></HashMap>