{"database":"biostudies-literature","file_versions":[],"scores":null,"additional":{"submitter":["Biswas S"],"funding":["Deutsche Forschungsgemeinschaft"],"pagination":["4909"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC6817866"],"repository":["biostudies-literature"],"omics_type":["Unknown"],"volume":["10(1)"],"pubmed_abstract":["Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and opt"],"journal":["Nature communications"],"pubmed_title":["Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix."],"pmcid":["PMC6817866"],"funding_grant_id":["JA1023/8-1","STA556/8-1","JA 1023/3-1"],"pubmed_authors":["Stauden T","Pezoldt J","Biswas S","Jacobs HO","Reiprich J","Hao Y","Schoeberl A"],"additional_accession":[]},"is_claimable":false,"name":"Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.","description":"Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and opt","dates":{"release":"2019-01-01T00:00:00Z","publication":"2019 Oct","modification":"2025-04-19T17:10:52.049Z","creation":"2019-11-07T08:08:14Z"},"accession":"S-EPMC6817866","cross_references":{"pubmed":["31659160"],"doi":["10.1038/s41467-019-12870-7"]}}