<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Ao DW</submitter><funding>Science and Technology plan project of Shenzhen</funding><funding>Guangdong Basic and Applied Basic Research Foundation</funding><funding>National Natural Science Foundation of China</funding><pagination>e2103547</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC8844477</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>9(5)</volume><pubmed_abstract>Flexible Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> -based thermoelectric devices can function as power generators for powering wearable electronics or chip-sensors for internet-of-things. However, the unsatisfied performance of n-type Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> flexible thin films significantly limits their wide application. In this study, a novel thermal diffusion method is employed to fabricate n-type Te-embedded Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> flexible thin films on flexible polyimide substrates, where Te embeddings can be achieved by tuning the thermal diffusion temperature and correspondingly result in an energy filtering effect at the Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> /Te interfaces. The energy filtering effect can lead to a high Seebeck coefficient ≈160 µV K&lt;sup>-1&lt;/sup> as well as high carrier mo</pubmed_abstract><journal>Advanced science (Weinheim, Baden-Wurttemberg, Germany)</journal><pubmed_title>Novel Thermal Diffusion Temperature Engineering Leading to High Thermoelectric Performance in Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> -Based Flexible Thin-Films.</pubmed_title><pmcid>PMC8844477</pmcid><funding_grant_id>2020A1515010515</funding_grant_id><funding_grant_id>2019A1515110107</funding_grant_id><funding_grant_id>11604212</funding_grant_id><funding_grant_id>20200811230408001</funding_grant_id><pubmed_authors>Wei M</pubmed_authors><pubmed_authors>Zhang XH</pubmed_authors><pubmed_authors>Ao DW</pubmed_authors><pubmed_authors>Chen ZG</pubmed_authors><pubmed_authors>Zheng ZH</pubmed_authors><pubmed_authors>Li F</pubmed_authors><pubmed_authors>Liu WD</pubmed_authors><pubmed_authors>Chen YX</pubmed_authors><pubmed_authors>Jabar B</pubmed_authors><pubmed_authors>Fan P</pubmed_authors><pubmed_authors>Shi XL</pubmed_authors><pubmed_authors>Liang GX</pubmed_authors></additional><is_claimable>false</is_claimable><name>Novel Thermal Diffusion Temperature Engineering Leading to High Thermoelectric Performance in Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> -Based Flexible Thin-Films.</name><description>Flexible Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> -based thermoelectric devices can function as power generators for powering wearable electronics or chip-sensors for internet-of-things. However, the unsatisfied performance of n-type Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> flexible thin films significantly limits their wide application. In this study, a novel thermal diffusion method is employed to fabricate n-type Te-embedded Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> flexible thin films on flexible polyimide substrates, where Te embeddings can be achieved by tuning the thermal diffusion temperature and correspondingly result in an energy filtering effect at the Bi&lt;sub>2&lt;/sub> Te&lt;sub>3&lt;/sub> /Te interfaces. The energy filtering effect can lead to a high Seebeck coefficient ≈160 µV K&lt;sup>-1&lt;/sup> as well as high carrier mo</description><dates><release>2022-01-01T00:00:00Z</release><publication>2022 Feb</publication><modification>2026-03-27T16:41:59.754Z</modification><creation>2025-04-04T08:41:14.181Z</creation></dates><accession>S-EPMC8844477</accession><cross_references><pubmed>34939357</pubmed><doi>10.1002/advs.202103547</doi></cross_references></HashMap>