<HashMap><database>biostudies-literature</database><scores/><additional><omics_type>Unknown</omics_type><volume>603(7901)</volume><submitter>Kim SJ</submitter><pubmed_abstract>Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications&lt;sup>1-7&lt;/sup>. This has prompted numerous studies exploring copper oxidation and possible passivation strategies&lt;sup>8&lt;/sup>. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu&lt;sub>2&lt;/sub>O growth occurs on flat surfaces as a result of Cu adatoms detaching from steps and diffusing across terraces&lt;sup>9-11&lt;/sup>. But even though this mechanism explains why single-crystalline copper is more resistant to oxidation than polycrystalline copper, the fact that flat copper surfaces can be free of oxidation has not been explored further. Here we report the fabrication of copper thin films that are semi-pe</pubmed_abstract><journal>Nature</journal><pagination>434-438</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC8930770</full_dataset_link><repository>biostudies-literature</repository><pubmed_title>Flat-surface-assisted and self-regulated oxidation resistance of Cu(111).</pubmed_title><pmcid>PMC8930770</pmcid><pubmed_authors>Cho CR</pubmed_authors><pubmed_authors>Jeong SY</pubmed_authors><pubmed_authors>Kim J</pubmed_authors><pubmed_authors>Lee YH</pubmed_authors><pubmed_authors>Ha T</pubmed_authors><pubmed_authors>Cheon M</pubmed_authors><pubmed_authors>Kim SG</pubmed_authors><pubmed_authors>Kim YM</pubmed_authors><pubmed_authors>Lamichhane B</pubmed_authors><pubmed_authors>Kim YI</pubmed_authors><pubmed_authors>Kim YH</pubmed_authors><pubmed_authors>Jeong HY</pubmed_authors><pubmed_authors>Lee Y</pubmed_authors><pubmed_authors>Kim SJ</pubmed_authors><pubmed_authors>Kim JC</pubmed_authors></additional><is_claimable>false</is_claimable><name>Flat-surface-assisted and self-regulated oxidation resistance of Cu(111).</name><description>Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications&lt;sup>1-7&lt;/sup>. This has prompted numerous studies exploring copper oxidation and possible passivation strategies&lt;sup>8&lt;/sup>. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu&lt;sub>2&lt;/sub>O growth occurs on flat surfaces as a result of Cu adatoms detaching from steps and diffusing across terraces&lt;sup>9-11&lt;/sup>. But even though this mechanism explains why single-crystalline copper is more resistant to oxidation than polycrystalline copper, the fact that flat copper surfaces can be free of oxidation has not been explored further. Here we report the fabrication of copper thin films that are semi-pe</description><dates><release>2022-01-01T00:00:00Z</release><publication>2022 Mar</publication><modification>2025-04-21T23:09:49.63Z</modification><creation>2025-04-05T19:06:25.829Z</creation></dates><accession>S-EPMC8930770</accession><cross_references><pubmed>35296844</pubmed><doi>10.1038/s41586-021-04375-5</doi></cross_references></HashMap>