biostudies-literatureRitacco TMinistero dell?Istruzione, dell?Universit? e della RicercaMinisterio de Ciencia, Innovaci?n y Universidades17754-17762https://www.ebi.ac.uk/biostudies/studies/S-EPMC9026244biostudies-literatureUnknown14(15)This paper reports on the nanofabrication of a fiber-reinforced polymer nanocomposite (FRPN) by two-photon direct laser writing (TP-DLW) using silica nanowires (SiO₂ NWs) as nanofillers, since they feature a refractive index very close to that of the photoresist used as a polymeric matrix. This allows for the best resolution offered by the TP-DLW technique, even with high loads of SiO₂ NWs, up to 70 wt %. The FRPN presented an increase of approximately 4 times in Young's modulus (8.23 GPa) and nanohardness (120 MPa) when compared to those of the bare photoresist, indicating how the proposed technique is well-suited for applications with higher structural requirements. Moreover, three different printing configurations can be implemented thanks to the use of silicon chiACS applied materials & interfacesHigh-Resolution 3D Fabrication of Glass Fiber-Reinforced Polymer Nanocomposite (FRPN) Objects by Two-Photon Direct Laser Writing.PMC9026244H26J20001560005IJC2019-041128-IDi Cianni WPerziano DConvertino ASanz de Leon ADe Luca AMagaro PMaletta CRitacco TGiocondo MfalseHigh-Resolution 3D Fabrication of Glass Fiber-Reinforced Polymer Nanocomposite (FRPN) Objects by Two-Photon Direct Laser Writing.This paper reports on the nanofabrication of a fiber-reinforced polymer nanocomposite (FRPN) by two-photon direct laser writing (TP-DLW) using silica nanowires (SiO₂ NWs) as nanofillers, since they feature a refractive index very close to that of the photoresist used as a polymeric matrix. This allows for the best resolution offered by the TP-DLW technique, even with high loads of SiO₂ NWs, up to 70 wt %. The FRPN presented an increase of approximately 4 times in Young's modulus (8.23 GPa) and nanohardness (120 MPa) when compared to those of the bare photoresist, indicating how the proposed technique is well-suited for applications with higher structural requirements. Moreover, three different printing configurations can be implemented thanks to the use of silicon chi2022-01-01T00:00:00Z2022 Apr2025-04-04T19:09:46.77Z2025-04-04T19:09:46.77ZS-EPMC90262443539473810.1021/acsami.1c21708