<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Wu J</submitter><funding>Chinese Academy of Sciences</funding><funding>National Natural Science Foundation of China</funding><pagination>5721-5727</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC9078233</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>8(11)</volume><pubmed_abstract>Organic optoelectronic devices, especially for OLEDs, are extremely susceptibility to water vapor and oxygen which limit their widespread commercialization. In order to extend the shelf-lifetime of devices, thin film encapsulation is the most promising and challenging encapsulation process. In this study, dyad-style multilayer encapsulation structures based on alternating Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> layer and parylene C have been discussed as gas diffusion barriers, in which dense and pinhole-free Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> films were grown by atomic layer deposition (ALD) and flexible parylene C layers were deposited by chemical vapor deposition (CVD). We found the particle in ALD deposited Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> films process is the key killer to barrier property. The thickness of </pubmed_abstract><journal>RSC advances</journal><pubmed_title>Efficient multi-barrier thin film encapsulation of OLED using alternating Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> and polymer layers.</pubmed_title><pmcid>PMC9078233</pmcid><funding_grant_id>XDA09020201</funding_grant_id><funding_grant_id>U1605244</funding_grant_id><pubmed_authors>Wu J</pubmed_authors><pubmed_authors>Nie S</pubmed_authors><pubmed_authors>Zhang D</pubmed_authors><pubmed_authors>Wei C</pubmed_authors><pubmed_authors>Cui Z</pubmed_authors><pubmed_authors>Fei F</pubmed_authors><pubmed_authors>Chen X</pubmed_authors><pubmed_authors>Su W</pubmed_authors></additional><is_claimable>false</is_claimable><name>Efficient multi-barrier thin film encapsulation of OLED using alternating Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> and polymer layers.</name><description>Organic optoelectronic devices, especially for OLEDs, are extremely susceptibility to water vapor and oxygen which limit their widespread commercialization. In order to extend the shelf-lifetime of devices, thin film encapsulation is the most promising and challenging encapsulation process. In this study, dyad-style multilayer encapsulation structures based on alternating Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> layer and parylene C have been discussed as gas diffusion barriers, in which dense and pinhole-free Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> films were grown by atomic layer deposition (ALD) and flexible parylene C layers were deposited by chemical vapor deposition (CVD). We found the particle in ALD deposited Al&lt;sub>2&lt;/sub>O&lt;sub>3&lt;/sub> films process is the key killer to barrier property. The thickness of </description><dates><release>2018-01-01T00:00:00Z</release><publication>2018 Feb</publication><modification>2025-04-19T10:45:48.702Z</modification><creation>2024-11-14T03:45:04.582Z</creation></dates><accession>S-EPMC9078233</accession><cross_references><pubmed>35539605</pubmed><doi>10.1039/c8ra00023a</doi></cross_references></HashMap>