{"database":"biostudies-literature","file_versions":[],"scores":null,"additional":{"omics_type":["Unknown"],"volume":["13(1)"],"submitter":["Li M"],"pubmed_abstract":["With speeding up development of 5 G chips, high-efficient thermal structure and precise management of tremendous heat becomes a substantial challenge to the power-hungry electronics. Here, we demonstrate an interpenetrating architecture of electrocaloric polymer with highly thermally conductive pathways that achieves a 240% increase in the electrocaloric performance and a 300% enhancement in the thermal conductivity of the polymer. A scaled-up version of the device prototype for a single heat spot cooling of 5 G chip is fabricated utilizing this electrocaloric composite and electromagnetic actuation. The continuous three-dimensional (3-D) thermal conductive network embedded in the polymer acts as nucleation sites of the ordered dipoles under applied electric field, efficiently collects the"],"journal":["Nature communications"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC9532434"],"repository":["biostudies-literature"],"pubmed_title":["Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration"],"pmcid":["PMC9532434"],"pubmed_authors":["Li J","Shen Q","Gan J","Wang F","Chen X","Wang X","Shen X","Li M"],"additional_accession":[]},"is_claimable":false,"name":"Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration","description":"With speeding up development of 5 G chips, high-efficient thermal structure and precise management of tremendous heat becomes a substantial challenge to the power-hungry electronics. Here, we demonstrate an interpenetrating architecture of electrocaloric polymer with highly thermally conductive pathways that achieves a 240% increase in the electrocaloric performance and a 300% enhancement in the thermal conductivity of the polymer. A scaled-up version of the device prototype for a single heat spot cooling of 5 G chip is fabricated utilizing this electrocaloric composite and electromagnetic actuation. The continuous three-dimensional (3-D) thermal conductive network embedded in the polymer acts as nucleation sites of the ordered dipoles under applied electric field, efficiently collects the","dates":{"release":"2022-01-01T00:00:00Z","publication":"2022 Jan","modification":"2025-04-26T15:39:09.323Z","creation":"2025-04-06T14:55:09.033Z"},"accession":"S-EPMC9532434","cross_references":{}}