<HashMap><database>biostudies-literature</database><scores/><additional><omics_type>Unknown</omics_type><volume>13(1)</volume><submitter>Li M</submitter><pubmed_abstract>With speeding up development of 5 G chips, high-efficient thermal structure and precise management of tremendous heat becomes a substantial challenge to the power-hungry electronics. Here, we demonstrate an interpenetrating architecture of electrocaloric polymer with highly thermally conductive pathways that achieves a 240% increase in the electrocaloric performance and a 300% enhancement in the thermal conductivity of the polymer. A scaled-up version of the device prototype for a single heat spot cooling of 5 G chip is fabricated utilizing this electrocaloric composite and electromagnetic actuation. The continuous three-dimensional (3-D) thermal conductive network embedded in the polymer acts as nucleation sites of the ordered dipoles under applied electric field, efficiently collects the</pubmed_abstract><journal>Nature communications</journal><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC9532434</full_dataset_link><repository>biostudies-literature</repository><pubmed_title>Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration</pubmed_title><pmcid>PMC9532434</pmcid><pubmed_authors>Li J</pubmed_authors><pubmed_authors>Shen Q</pubmed_authors><pubmed_authors>Gan J</pubmed_authors><pubmed_authors>Wang F</pubmed_authors><pubmed_authors>Chen X</pubmed_authors><pubmed_authors>Wang X</pubmed_authors><pubmed_authors>Shen X</pubmed_authors><pubmed_authors>Li M</pubmed_authors></additional><is_claimable>false</is_claimable><name>Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration</name><description>With speeding up development of 5 G chips, high-efficient thermal structure and precise management of tremendous heat becomes a substantial challenge to the power-hungry electronics. Here, we demonstrate an interpenetrating architecture of electrocaloric polymer with highly thermally conductive pathways that achieves a 240% increase in the electrocaloric performance and a 300% enhancement in the thermal conductivity of the polymer. A scaled-up version of the device prototype for a single heat spot cooling of 5 G chip is fabricated utilizing this electrocaloric composite and electromagnetic actuation. The continuous three-dimensional (3-D) thermal conductive network embedded in the polymer acts as nucleation sites of the ordered dipoles under applied electric field, efficiently collects the</description><dates><release>2022-01-01T00:00:00Z</release><publication>2022 Jan</publication><modification>2025-04-26T15:39:09.323Z</modification><creation>2025-04-06T14:55:09.033Z</creation></dates><accession>S-EPMC9532434</accession><cross_references/></HashMap>