<HashMap><database>biostudies-literature</database><scores/><additional><submitter>Xu YD</submitter><funding>National Natural Science Foundation of China</funding><pagination>39</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC9823911</full_dataset_link><repository>biostudies-literature</repository><omics_type>Unknown</omics_type><volume>13(1)</volume><pubmed_abstract>Resistive random-access memory (RRAM) is a promising candidate for next-generation non-volatile memory. However, due to the random formation and rupture of conductive filaments, RRMS still has disadvantages, such as small storage windows and poor stability. Therefore, the performance of RRAM can be improved by optimizing the formation and rupture of conductive filaments. In this study, a hafnium oxide-/aluminum-doped zinc oxide/hafnium oxide (HfO&lt;sub>2&lt;/sub>/Al-ZnO/HfO&lt;sub>2&lt;/sub>) tri-layer structure device was prepared using the sol-gel method. The oxygen-rich vacancy Al-ZnO layer was inserted into the HfO&lt;sub>2&lt;/sub> layers. The device had excellent RS properties, such as an excellent switch ratio of 10&lt;sup>4&lt;/sup>, retention of 10&lt;sup>4&lt;/sup> s, and multi-level storage capability of si</pubmed_abstract><journal>Nanomaterials (Basel, Switzerland)</journal><pubmed_title>Enhancement of Resistive Switching Performance in Hafnium Oxide (HfO&lt;sub>2&lt;/sub>) Devices via Sol-Gel Method Stacking Tri-Layer HfO&lt;sub>2&lt;/sub>/Al-ZnO/HfO&lt;sub>2&lt;/sub> Structures.</pubmed_title><pmcid>PMC9823911</pmcid><funding_grant_id>Grant Nos.12172093 and 11932016</funding_grant_id><pubmed_authors>Tang Z</pubmed_authors><pubmed_authors>Liu QX</pubmed_authors><pubmed_authors>Guo XB</pubmed_authors><pubmed_authors>Xu YD</pubmed_authors><pubmed_authors>Jiang YP</pubmed_authors><pubmed_authors>Tang XG</pubmed_authors><pubmed_authors>Li WH</pubmed_authors><pubmed_authors>Zhou YC</pubmed_authors></additional><is_claimable>false</is_claimable><name>Enhancement of Resistive Switching Performance in Hafnium Oxide (HfO&lt;sub>2&lt;/sub>) Devices via Sol-Gel Method Stacking Tri-Layer HfO&lt;sub>2&lt;/sub>/Al-ZnO/HfO&lt;sub>2&lt;/sub> Structures.</name><description>Resistive random-access memory (RRAM) is a promising candidate for next-generation non-volatile memory. However, due to the random formation and rupture of conductive filaments, RRMS still has disadvantages, such as small storage windows and poor stability. Therefore, the performance of RRAM can be improved by optimizing the formation and rupture of conductive filaments. In this study, a hafnium oxide-/aluminum-doped zinc oxide/hafnium oxide (HfO&lt;sub>2&lt;/sub>/Al-ZnO/HfO&lt;sub>2&lt;/sub>) tri-layer structure device was prepared using the sol-gel method. The oxygen-rich vacancy Al-ZnO layer was inserted into the HfO&lt;sub>2&lt;/sub> layers. The device had excellent RS properties, such as an excellent switch ratio of 10&lt;sup>4&lt;/sup>, retention of 10&lt;sup>4&lt;/sup> s, and multi-level storage capability of si</description><dates><release>2022-01-01T00:00:00Z</release><publication>2022 Dec</publication><modification>2025-04-21T16:19:50.981Z</modification><creation>2025-04-21T16:19:50.981Z</creation></dates><accession>S-EPMC9823911</accession><cross_references><pubmed>36615949</pubmed><doi>10.3390/nano13010039</doi></cross_references></HashMap>