<HashMap><database>biostudies-literature</database><scores/><additional><omics_type>Unknown</omics_type><volume>13(4)</volume><submitter>Tian Y</submitter><pubmed_abstract>Copper is an important interconnect material in integrated circuits (IC) due to its outstanding electrical and thermal properties. However, the development of the IC industry requires novel interconnect materials with higher conductivity. Here, uniform graphene oxide (GO) is deposited on copper by electrophoretic deposition (EPD) to obtain a GO-Cu bilayer structure at room temperature. (3-Mercaptopropyl) trimethoxysilane (MPTS) is self-assembled on the Cu anode surface, which protects the anode from oxidation during the EPD process. We find that the &lt;i>in situ&lt;/i> hydrolysis of methoxy under the promotion of EPD voltage can facilitate the uniform deposition of GO and enhance the interface bonding force. In order to achieve better electrical performance, different reduction methods are cond</pubmed_abstract><journal>RSC advances</journal><pagination>2372-2378</pagination><full_dataset_link>https://www.ebi.ac.uk/biostudies/studies/S-EPMC9841510</full_dataset_link><repository>biostudies-literature</repository><pubmed_title>Electrochemically reduced graphene oxide (ERGO)-Cu bilayer structure fabricated at room temperature for future interconnects.</pubmed_title><pmcid>PMC9841510</pmcid><pubmed_authors>Cao L</pubmed_authors><pubmed_authors>Chen P</pubmed_authors><pubmed_authors>Tian Y</pubmed_authors><pubmed_authors>Han S</pubmed_authors><pubmed_authors>Hu A</pubmed_authors><pubmed_authors>Li M</pubmed_authors><pubmed_authors>Wu Y</pubmed_authors></additional><is_claimable>false</is_claimable><name>Electrochemically reduced graphene oxide (ERGO)-Cu bilayer structure fabricated at room temperature for future interconnects.</name><description>Copper is an important interconnect material in integrated circuits (IC) due to its outstanding electrical and thermal properties. However, the development of the IC industry requires novel interconnect materials with higher conductivity. Here, uniform graphene oxide (GO) is deposited on copper by electrophoretic deposition (EPD) to obtain a GO-Cu bilayer structure at room temperature. (3-Mercaptopropyl) trimethoxysilane (MPTS) is self-assembled on the Cu anode surface, which protects the anode from oxidation during the EPD process. We find that the &lt;i>in situ&lt;/i> hydrolysis of methoxy under the promotion of EPD voltage can facilitate the uniform deposition of GO and enhance the interface bonding force. In order to achieve better electrical performance, different reduction methods are cond</description><dates><release>2023-01-01T00:00:00Z</release><publication>2023 Jan</publication><modification>2025-04-05T13:31:24.874Z</modification><creation>2025-04-05T13:31:24.874Z</creation></dates><accession>S-EPMC9841510</accession><cross_references><pubmed>36741139</pubmed><doi>10.1039/d2ra07223h</doi></cross_references></HashMap>