{"database":"biostudies-other","file_versions":[],"scores":null,"additional":{"omics_type":["Unknown"],"volume":["7(12)"],"submitter":["Halim MYA"],"journal":["Materials (Basel, Switzerland)"],"pagination":["7737-7751"],"full_dataset_link":["https://www.ebi.ac.uk/biostudies/studies/S-EPMC5456440"],"abstract":["Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO₃: H₂O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO₄ in the presence of HF. Scanning electron microscopy (SEM) analysis revealed that the Cu particles aggregated upon an increase in metal content from 3.3 wt% to 9.8 wt%. H₂-temperature programmed reduction (H₂-TPR) profiles reveal that re-oxidation of the Cu particles occurs after deposition. Furthermore, the profiles denote the existence of various sizes of Cu metal on the PS. The Cu-PS powders show excellent catalytic reduction on the p-nitrophenol regardless of the Cu loadings."],"repository":["biostudies-other"],"data_source":["Europe PMC"],"pubmed_authors":["Bakar NHHA","Halim MYA","Tan WL","Bakar MA"],"additional_accession":[]},"is_claimable":false,"name":"Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder.","description":"Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO₃: H₂O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO₄ in the presence of HF. Scanning electron microscopy (SEM) analysis revealed that the Cu particles aggregated upon an increase in metal content from 3.3 wt% to 9.8 wt%. H₂-temperature programmed reduction (H₂-TPR) profiles reveal that re-oxidation of the Cu particles occurs after deposition. Furthermore, the profiles denote the existence of various sizes of Cu metal on the PS. The Cu-PS powders show excellent catalytic reduction on the p-nitrophenol regardless of the Cu loadings.","dates":{"release":"2014-01-01T00:00:00Z","publication":"2014 Dec","modification":"2019-08-04T08:15:36Z","creation":"2019-08-04T08:15:36Z"},"accession":"S-EPMC5456440","cross_references":{"DOI":["10.3390/ma7127737 "]}}