Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.

ABSTRACT: To solve the electromigration problem of micro-electronic connection solder joints, an ideal electromigration tester was designed, and the thickness of the intermetallic compounds (IMCs), average void diameter, grain orientation, failure, shear strength, and fracture path of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu solder joints under constant-temperature electromigration were studied. The results indicate that the solder joints show evidence of typical electromigration polarity in the asymmetric growth of interfacial IMCs on the anode and cathode sides under the conditions of a current density ≥7 × 10³ A/cm² and an included angle between the c-axis of the β-Sn grains and the current direction θ ≤ 53.2°. The anode-side interfacial IMC is dominated by a Cu₆Sn_5</

SUBMITTER: Zhang C 

PROVIDER: S-EPMC10095658 | biostudies-literature | 2023 Mar

REPOSITORIES: biostudies-literature