Wafer-scale high-κ dielectrics for two-dimensional circuits via van der Waals integration.

ABSTRACT: The practical application of two-dimensional (2D) semiconductors for high-performance electronics requires the integration with large-scale and high-quality dielectrics-which however have been challenging to deposit to date, owing to their dangling-bonds-free surface. Here, we report a dry dielectric integration strategy that enables the transfer of wafer-scale and high-κ dielectrics on top of 2D semiconductors. By utilizing an ultra-thin buffer layer, sub-3 nm thin Al₂O₃ or HfO₂ dielectrics could be pre-deposited and then mechanically dry-transferred on top of MoS₂ monolayers. The transferred ultra-thin dielectric film could retain wafer-scale flatness and uniformity without any cracks, demonstrating a capacitance up to 2.8 μF/cm², eq

SUBMITTER: Lu Z 

PROVIDER: S-EPMC10125989 | biostudies-literature | 2023 Apr

REPOSITORIES: biostudies-literature