Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

ABSTRACT: As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitry but have not yet delivered device-grade materials. To highlight the complex role of processing on the quality and microstructure of AM metals, we report the electrical properties of micrometer-scale copper interconnects fabricated by Fluid Force Microscopy (FluidFM) and Electrohydrodynamic-Redox Printing (EHD-RP). Using a thin film-based 4-terminal testing chip developed for the scope of this study, the electrical resistance of as-printed metals is directly related to print strategies and the

SUBMITTER: Menetrey M 

PROVIDER: S-EPMC10155493 | biostudies-literature | 2023 May

REPOSITORIES: biostudies-literature