Ontology highlight
ABSTRACT:
SUBMITTER: Paulachan P
PROVIDER: S-EPMC10256798 | biostudies-literature | 2023 Jun
REPOSITORIES: biostudies-literature

Paulachan Priya P Siegert Jörg J Wiesler Ingo I Brunner Roland R
Scientific reports 20230609 1
The advancement in the field of 3D integration circuit technology leads to new challenges for quality assessment of interconnects such as through silicon vias (TSVs) in terms of automated and time-efficient analysis. In this paper, we develop a fully automated high-efficient End-to-End Convolutional Neural Network (CNN) model, utilizing two sequentially linked CNN architectures, suitable to classify and locate thousands of TSVs as well as provide statistical information. In particular, we genera ...[more]