Liquid metal droplets bouncing higher on thicker water layer.

ABSTRACT: Liquid metal (LM) has gained increasing attention for a wide range of applications, such as flexible electronics, soft robots, and chip cooling devices, owing to its low melting temperature, good flexibility, and high electrical and thermal conductivity. In ambient conditions, LM is susceptible to the coverage of a thin oxide layer, resulting in unwanted adhesion with underlying substrates that undercuts its originally high mobility. Here, we discover an unusual phenomenon characterized by the complete rebound of LM droplets from the water layer with negligible adhesion. More counterintuitively, the restitution coefficient, defined as the ratio between the droplet velocities after and before impact, increases with water layer thickness. We reveal that the complete rebound of LM droplets or

SUBMITTER: Dai Y 

PROVIDER: S-EPMC10267135 | biostudies-literature | 2023 Jun

REPOSITORIES: biostudies-literature