Extremely large area (88 mm × 88 mm) superconducting integrated circuit (ELASIC).

ABSTRACT: Superconducting integrated circuit is a promising "beyond-CMOS" device technology enables speed-of-light, nearly lossless communications to advance cryogenic (4 K or lower) computing. However, the lack of large-area superconducting IC has hindered the development of scalable practical systems. Herein, we describe a novel approach to interconnect 16 high-resolution deep UV (DUV EX4, 248 nm lithography) full reticle circuits to fabricate an extremely large (88 mm × 88 mm) area superconducting integrated circuit (ELASIC). The fabrication process starts by interconnecting four high-resolution DUV EX4 (22 mm × 22 mm) full reticles using a single large-field (44 mm × 44 mm) I-line (365 nm lithography) reticle, followed by I-line reticle stitching at the boundaries of 44 mm × 44 mm fields to fabr

SUBMITTER: Das RN 

PROVIDER: S-EPMC10361992 | biostudies-literature | 2023 Jul

REPOSITORIES: biostudies-literature