Wrap-like transfer printing for three-dimensional curvy electronics.

ABSTRACT: Three-dimensional (3D) curvy electronics has wide-ranging application in biomedical health care, soft machine, and high-density curved imager. Limited by material properties, complex procedures, and coverage ability of existing fabrication techniques, the development of high-performance 3D curvy electronics remains challenging. Here, we propose an automated wrap-like transfer printing prototype for fabricating 3D curvy electronics. Assisted by a gentle and uniform pressure field, the prefabricated planar circuits on the petal-like stamp are integrated onto the target surface intactly with full coverage. The driving pressure for the wrapping is provided by the strain recovery of a prestrained elastic film triggered by the air pressure control. The wrapping configuration and strain distribut

SUBMITTER: Chen X 

PROVIDER: S-EPMC10371014 | biostudies-literature | 2023 Jul

REPOSITORIES: biostudies-literature