Self-aligned patterning of tantalum oxide on Cu/SiO₂ through redox-coupled inherently selective atomic layer deposition.

ABSTRACT: Atomic-scale precision alignment is a bottleneck in the fabrication of next-generation nanoelectronics. In this study, a redox-coupled inherently selective atomic layer deposition (ALD) is introduced to tackle this challenge. The 'reduction-adsorption-oxidation' ALD cycles are designed by adding an in-situ reduction step, effectively inhibiting nucleation on copper. As a result, tantalum oxide exhibits selective deposition on various oxides, with no observable growth on Cu. Furthermore, the self-aligned TaO_x is successfully deposited on Cu/SiO₂ nanopatterns, avoiding excessive mushroom growth at the edges or the emergence of undesired nucleation defects within the Cu region. The film thickness on SiO₂ exceeds 5 nm with a selectivity of 100%, marking it as o

SUBMITTER: Li Y 

PROVIDER: S-EPMC10372027 | biostudies-literature | 2023 Jul

REPOSITORIES: biostudies-literature