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Built-In Packaging for Two-Terminal Devices.

ABSTRACT: Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.

SUBMITTER: Gulsaran A

PROVIDER: S-EPMC10384851 | biostudies-literature | 2023 Jul

REPOSITORIES: biostudies-literature

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Built-In Packaging for Two-Terminal Devices.

Gulsaran Ahmet A Bastug Azer Bersu B Ozyigit Dogu D Saritas Resul R Kocer Samed S Abdel-Rahman Eihab E Yavuz Mustafa M

Micromachines 20230722 7

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% i ...[more]

PMID: 37512784

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