Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards† † Electronic supplementary information (ESI) available. See DOI: https://doi.org/10.1039/d3ra03839d

ABSTRACT: Polytetrafluoroethylene (PTFE) serves as a suitable dielectric substrate for high-frequency printed wiring boards (PWBs) owing to its excellent properties at high frequency. However, to the best of our knowledge, no study has investigated the strong adhesion between PTFE and Cu foil with low surface roughness. Therefore, in this study, pure-PTFE comprising a weak boundary layer (WBL) on the surface and glass-cloth-containing PTFE (GC-PTFE), which did not contain a WBL, were subjected to heat-assisted plasma (HAP) treatment. Thereafter, we investigated the surface chemical bonding state, surface morphology, and adhesion properties of the as-prepared PTFE toward Cu foil with low surface roughness. As observed, oxygen-containing functional groups were generated on the HAP-treated PTFE, and th

SUBMITTER: Nishino M 

PROVIDER: S-EPMC10466178 | biostudies-literature | 2023 Aug

REPOSITORIES: biostudies-literature