Curing Kinetics and Mechanical Properties of Epoxy-Cyanate Ester Composite Films for Microelectronic Applications.

ABSTRACT: In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy-cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions. The results showed that the curing reaction of the build-up film contains two curing reaction processes, a

SUBMITTER: Ding S 

PROVIDER: S-EPMC10500575 | biostudies-literature | 2023 Sep

REPOSITORIES: biostudies-literature