Enhanced Removal of Photoresist Films through Swelling and Dewetting Using Pluronic Surfactants.

ABSTRACT: Organic photoresist coatings, primarily composed of resins, are commonly used in the electronics industry to protect inorganic underlayers. Conventional photoresist strippers, such as amine-type agents, have shown high removal performance but led to environmental impact and substrate corrosiveness. Therefore, this trade-off must be addressed. In this study, we characterized the removal mechanism of a photoresist film using a nonionic triblock Pluronic surfactant [poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide)] in a ternary mixture of ethylene carbonate (EC), propylene carbonate (PC), and water. In particular, the removal dynamics determined by using a quartz crystal microbalance with dissipation monitoring was compared with those determined by performing confocal laser sca

SUBMITTER: Hanzawa M 

PROVIDER: S-EPMC10586462 | biostudies-literature | 2023 Oct

REPOSITORIES: biostudies-literature