Copper Sintering Pastes with Various Polar Solvents and Acidic Activators.

ABSTRACT: Devices in the developing semiconductor market require high density, high integration, and detailed processing. Conventional wire bonding is inappropriate for fine-sized devices, and connected wires can be damaged by heat generation and external physical impact. Soldering is also used in advanced packaging technologies. However, disturbances and overhead joints can occur during bonding. Thus, sintering has been extensively utilized to overcome these drawbacks. Sintering pastes are pressurized and bonded, resulting in stable bonding during sintering. In this study, the composition of the Cu sintering material was examined using diverse additives and solvents. We manufactured sintering materials comprising Cu (1 μm), a solvent [methanol (MeOH), ethanol (EtOH), or ethylene glycol (EG)] and an

SUBMITTER: Lee S 

PROVIDER: S-EPMC10601074 | biostudies-literature | 2023 Oct

REPOSITORIES: biostudies-literature