Wafer-scale organic-on-III-V monolithic heterogeneous integration for active-matrix micro-LED displays.

ABSTRACT: The organic thin-film transistor is advantageous for monolithic three-dimensional integration attributed to low temperature and facile solution processing. However, the electrical properties of solution deposited organic semiconductor channels are very sensitive to the substrate surface and processing conditions. An organic-last integration technology is developed for wafer-scale heterogeneous integration of a multi-layer organic material stack from solution onto the non-even substrate surface of a III-V micro light emitting diode plane. A via process is proposed to make the via interconnection after fabrication of the organic thin-film transistor. Low-defect uniform organic semiconductor and dielectric layers can then be formed on top to achieve high-quality interfaces. The resulting orga

SUBMITTER: Han L 

PROVIDER: S-EPMC10620182 | biostudies-literature | 2023 Nov

REPOSITORIES: biostudies-literature