Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies.

ABSTRACT: The rapid-developing soft robots and wearable devices require flexible conductive materials to maintain electric functions over a large range of deformations. Considerable efforts are made to develop stretchable conductive materials; little attention is paid to the frequent failures of integrated circuits caused by the interface mismatch of soft substrates and rigid silicon-based microelectronics. Here, we present a stretchable solder with good weldability that can strongly bond with electronic components, benefiting from the hierarchical assemblies of liquid metal particles, small-molecule modulators, and non-covalently crosslinked polymer matrix. Our self-solder shows high conductivity (>2×10⁵ S  m^-1), extreme stretchability (~1000%, and >600% with chip-integrated)

SUBMITTER: Ai L 

PROVIDER: S-EPMC10673831 | biostudies-literature | 2023 Nov

REPOSITORIES: biostudies-literature