The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials.

ABSTRACT: Pad-type thermal interface materials (TIMs) with composite structures are required to exhibit high thermal conductivity while maintaining conformal contact with the heat sink, which is strongly influenced by the type and content of the thermally conductive filler. This study presents that biphasic metal particles can be effectively aligned using the dielectrophoretic chaining (DEP-C) mechanism, thereby enhancing the thermal conductivity of a pad-type TIM. A eutectic gallium-indium (EGaIn) alloy liquid metal and solid copper were used as the filler materials with two different phases. The biphasic metal particle mixture of EGaIn and Cu (EGaIn-Cu) were better aligned by DEP-C than when they presented individually because fusion between the two particles increased the effective size. As expec

SUBMITTER: Lee Y 

PROVIDER: S-EPMC10747968 | biostudies-literature | 2023 Dec

REPOSITORIES: biostudies-literature