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A study on thermal behaviour of thermal barrier coating: investigation of particle size, YSZ/polysilazane, time and temperature curing effect.

ABSTRACT: Thermal conductivity and adhesion strength effects were studied for thermal barrier coatings (TBCs) with different particle sizes, YSZ content, time, and temperature curing. The study involves three stages. The first step focuses on the characteristics of YSZ/polysilazane as the TBC, which is characterized using Scanning Electron Microscopy (SEM), Fourier Transform Infrared (FTIR), X-Ray Diffraction (XRD), and Thermal Gravimetric Analysis (TGA). The second and third steps assess thermal conductivity and adhesion strength based on variables such as particle size, YSZ/polysilazane, time, and curing temperature. Results show that there was a synergistic effect between particle size-YSZ content and time-temperature curing to obtain specimens with good thermal properties. SB270/70 showed the lowest temperature compared to other specimens, up to 160 °C. Furthermore, YSZ/polysilazane thermal conductivity and adhesion properties could be enhanced by a prolonged curing time and higher temperature. This study emphasizes that the modification of particle size, YSZ content, time, and temperature curing is a promising strategy to improve the thermal properties of TBCs.

SUBMITTER: Widyastuti

PROVIDER: S-EPMC11302517 | biostudies-literature | 2024 Aug

REPOSITORIES: biostudies-literature

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A study on thermal behaviour of thermal barrier coating: investigation of particle size, YSZ/polysilazane, time and temperature curing effect.

Widyastuti Zulfa Liyana Labiba LL Rizaldi Wafiq Azhar WA Azhar Jauhari J Safrida Ninik N Pratama Azzah Dyah AD Wahyuono Ruri Agung RA Sulistijono Fajarin Rindang R Hakim Arif Nur AN

RSC advances 20240806 34

Thermal conductivity and adhesion strength effects were studied for thermal barrier coatings (TBCs) with different particle sizes, YSZ content, time, and temperature curing. The study involves three stages. The first step focuses on the characteristics of YSZ/polysilazane as the TBC, which is characterized using Scanning Electron Microscopy (SEM), Fourier Transform Infrared (FTIR), X-Ray Diffraction (XRD), and Thermal Gravimetric Analysis (TGA). The second and third steps assess thermal conducti ...[more]

PMID: 39108971

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Project description:The mechanical and high-temperature resistance properties of epoxy resins cured at low temperatures (Tcuring ≤ 100 °C) are often inferior, and the most toughening modification methods for epoxy resins tend to compromise thermal resistance, which significantly limit the practical applications of it. Therefore, this work reported a low viscosity and low-temperature curing epoxy hybrid resin system (OPEP), adopting E-51 as a resin matrix, liquid anhydride (MHHPA) as a curing agent, tertiary amine (DMBA) as a curing accelerator, and reactive octa-epoxy terminated polyhedral oligomeric silsesquioxane (OG-POSS) as a toughening modifier. Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing. The OG-POSS exhibits superior compatibility and reactivity with the resin matrix, and its addition slightly reduces the Eα of the curing reaction and has a certain promotive effect on the curing of epoxy resin. In addition, the curing reaction rate of the OPEP resin complies with the Šesták-Berggren autocatalytic kinetics model. The impact strength, flexural strength, tensile strength, and elongation at break of the OPEP resin reached a maximum of 15.55 kJ m-2, 121.65 MPa, 90.36 MPa, and 2.48%, representing increases of 55.97%, 3.1%, 64.68%, and 26.51% compared to those of the pure resin, respectively. Notably, due to the heat-resistant inorganic silicon cage structure of OG-POSS, the thermal decomposition temperature (Td5), glass transition temperature (Tg), and heat distortion temperature (THDT) of the OPEP0.02 resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic-inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.

Dataset Information

A study on thermal behaviour of thermal barrier coating: investigation of particle size, YSZ/polysilazane, time and temperature curing effect.

Publications

A study on thermal behaviour of thermal barrier coating: investigation of particle size, YSZ/polysilazane, time and temperature curing effect.

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