The 3D Monolithically Integrated Hardware Based Neural System with Enhanced Memory Window of the Volatile and Non-Volatile Devices.

ABSTRACT: 3D neuromorphic hardware system is first demonstrated in neuromorphic application as on-chip level by integrating array devices with CMOS circuits after wafer bonding (WB) and interconnection process. The memory window of synaptic device is degraded after WB and 3 Dimesional (3D) integration due to process defects and thermal stress. To address this degradation, Ag diffusion in materials of Ta₂O₅ and HfO₂ is studied in a volatile memristor, furthermore, the interconnection and gate metal Ru are investigated to reduce defective traps of gate interface in non-volatile memory devices. As a result, a memory window is improved over 10⁶ in both types of devices. Improved and 3D integrated 12 × 14 array devices are identified in the synaptic characteris

SUBMITTER: Jeon YR 

PROVIDER: S-EPMC11336934 | biostudies-literature | 2024 Aug

REPOSITORIES: biostudies-literature