Electroless Deposition for Robust and Uniform Copper Nanoparticles on Electrospun Polyacrylonitrile (PAN) Microfiltration Membranes.

ABSTRACT: Filtration membranes coated in metals such as copper have dramatically improved biofouling resistance and pathogen destruction. However, existing coating methods on polymer membranes impair membrane performance, lack uniformity, and may detach from their substrate, thus contaminating the permeate. To solve these challenges, we developed the first electroless deposition protocol to immobilize copper nanoparticles on electrospun polyacrylonitrile (PAN) fibers for the design of antimicrobial membranes. The deposition was facilitated by prior silver seeding. Distinct mats with average fiber diameters of 232 ± 36 nm, 727 ± 148 nm and 1017 ± 80 nm were evaluated for filtration performance. Well-dispersed copper nanoparticles were conformal to the fibers, preserving the open-cell architecture of

SUBMITTER: Aminu TQ 

PROVIDER: S-EPMC11434320 | biostudies-literature | 2024 Sep

REPOSITORIES: biostudies-literature