Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications.

ABSTRACT: We extensively studied serigraphic screen-printed commercial silver flake inks loaded with silicon inclusions in order to achieve pinning at the grain boundaries. Based on grain size measurements using electron backscattered diffraction (EBSD), commercial silver ink with silicon microparticle content of 5 wt.% shows significant grain growth retardation compared to pristine silver ink, which stabilizes electrical conductivity up to 700 °C via a Zener pinning mechanism. The modified silicon-loaded silver ink experiences a two-times increase in grain size when heated up to 700 °C, compared to a seven-times increase for pristine silver ink. In turn, this enables operation temperatures significantly higher than the conventional operational window of microparticle-based silver inks, which are us

SUBMITTER: Wadhwa A 

PROVIDER: S-EPMC11509728 | biostudies-literature | 2024 Oct

REPOSITORIES: biostudies-literature