Ultraflat Cu(111) foils by surface acoustic wave-assisted annealing.

ABSTRACT: Ultraflat metal foils are essential for semiconductor nanoelectronics applications and nanomaterial epitaxial growth. Numerous efforts have been devoted to metal surface engineering studies in the past decades. However, various challenges persist, including size limitations, polishing non-uniformities, and undesired contaminants. Thus, further exploration of advanced metal surface treatment techniques is essential. Here, we report a physical strategy that utilizes surface acoustic wave assisted annealing to flatten metal foils by eliminating the surface steps, eventually transforming commercial rough metal foils into ultraflat substrates. Large-area, high-quality, smooth 2D materials, including graphene and hexagonal boron nitride (hBN), were successfully grown on the resulting flat metal

SUBMITTER: Tian B 

PROVIDER: S-EPMC11531502 | biostudies-literature | 2024 Nov

REPOSITORIES: biostudies-literature