Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives.

ABSTRACT: Electroplating additives play a key role in enhancing the physical and chemical performances of electrodeposited copper foils. Currently, a lot of research on polyethylene glycol (PEG) additives has been reported on the metallisation interconnections for printed circuit boards (PCBs); however, research on its applications for electrodeposited copper foils is rarely documented. Herein, high-quality copper foils with high tensile strength (433.2 MPa) and low surface roughness (Rz = 1.7 μm) were electrodeposited on titanium substrates with 4 mg L^-1 PEG. The characterization results showed that the copper foil possesses a high (220) crystal plane orientation and low twin layer thickness. Further analysis suggested that twin boundaries strengthened by stacking faults were the main re

SUBMITTER: Huang J 

PROVIDER: S-EPMC11612898 | biostudies-literature | 2024 Nov

REPOSITORIES: biostudies-literature