Dynamics of Blister Actuation in Laser-Induced Forward Transfer for Contactless Microchip Transfer.

ABSTRACT: The rapid evolution of microelectronics and display technologies has driven the demand for advanced manufacturing techniques capable of precise, high-speed microchip transfer. As devices shrink in size and increase in complexity, scalable and contactless methods for microscale placement are essential. Laser-induced forward transfer (LIFT) has emerged as a transformative solution, offering the precision and adaptability required for next-generation applications such as micro-light-emitting diodes (μ-LEDs). This study optimizes the LIFT process for the precise transfer of silicon microchips designed to mimic μ-LEDs. Critical parameters, including laser energy density, laser pulse width, and dynamic release layer (DRL) thickness are systematically adjusted to ensure controlled blister formati

SUBMITTER: Kim D 

PROVIDER: S-EPMC11643012 | biostudies-literature | 2024 Nov

REPOSITORIES: biostudies-literature