In Situ Scanning Electron Microscopy Crack Characterization and Resistance Evolution in Cyclically-Strained Ag Nanoflake-Based Inks.

ABSTRACT: The reliability of nanocomposite conductive inks under cyclic loading is the key to designing robust flexible electronics. Although resistance increases with cycling and models exist, the exact degradation mechanism is not well understood and is critical for developing inks. This study links cracking behavior to changes in electrical resistance by performing in situ cyclic stretch experiments in scanning electron microscopy (SEM) with synchronized resistance measurements. Two screen-printed conductive inks, PE874 and 5025, on thermoplastic polyurethane (TPU) and polyimide (PI) substrates, respectively, were tested using the in situ technique. The obtained SEM images were analyzed with digital image correlation (DIC) to map the strain across cycles. The strain maps show that fatigue damage

SUBMITTER: Li Q 

PROVIDER: S-EPMC11650634 | biostudies-literature | 2024 Dec

REPOSITORIES: biostudies-literature