Cobalt-Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling.

ABSTRACT: In the rapidly advancing semiconductor sector, thermal management of chips remains a pivotal concern. Inherent heat generation during their operation can lead to a range of issues such as potential thermal runaway, diminished lifespan, and current leakage. To mitigate these challenges, the study introduces a superhygroscopic hydrogel embedded with metal ions. Capitalizing on intrinsic coordination chemistry, the metallic ions in the hydrogel form robust coordination structures with non-metallic nitrogen and oxygen through empty electron orbitals and lone electron pairs. This unique structure serves as an active site for water adsorption, beginning with a primary layer of chemisorbed water molecules and subsequently facilitating multi-layer physisorption via Van der Waals forces. Remarkably

SUBMITTER: Xi M 

PROVIDER: S-EPMC11672180 | biostudies-literature | 2024 Dec

REPOSITORIES: biostudies-literature