High-performance 2D electronic devices enabled by strong and tough two-dimensional polymer with ultra-low dielectric constant.

ABSTRACT: As the feature size of microelectronic circuits is scaling down to nanometer order, the increasing interconnect crosstalk, resistance-capacitance (RC) delay and power consumption can limit the chip performance and reliability. To address these challenges, new low-k dielectric (k < 2) materials need to be developed to replace current silicon dioxide (k = 3.9) or SiCOH, etc. However, existing low-k dielectric materials, such as organosilicate glass or polymeric dielectrics, suffer from poor thermal and mechanical properties. Two-dimensional polymers (2DPs) are considered promising low-k dielectric materials because of their good thermal and mechanical properties, high porosity and designability. Here, we report a chemical-vapor-deposition (CVD) method for growing fluoride rich 2DP-F films on

SUBMITTER: Fang Q 

PROVIDER: S-EPMC11685926 | biostudies-literature | 2024 Dec

REPOSITORIES: biostudies-literature