Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent.

ABSTRACT: Chemical mechanical planarization (CMP) is a technique used to efficiently prepare defect-free, flat surfaces of stainless steel (SS) foils and sheets that are implemented in various modern devices. CMP uses (electro)chemical reactions to structurally weaken the surface layers of a workpiece for easy removal by low-pressure mechanical abrasion. Using a model CMP system of 316/316L stainless steel (SS) in an acidic (pH = 3.63) slurry with alumina abrasives, citrate buffer (CB), and H₂O₂, we examine the tribo-electrochemical mechanisms of SS CMP that dictate the designs of functionally efficient and cost-effective CMP slurries. The use of CB as a pH-controlled complexing agent prevents defect-causing dissolution of SS and eliminates the need for using separate (often to

SUBMITTER: Santefort DR 

PROVIDER: S-EPMC11767002 | biostudies-literature | 2025 Jan

REPOSITORIES: biostudies-literature