The molecular mechanism by which heat stress during the grain filling period inhibits maize grain filling and reduces yield.

ABSTRACT: High temperatures significantly impair plant growth and development by restricting maize grain filling; however, the molecular mechanisms underlying heat stress remain poorly understood. In this study, 350 maize inbred lines were evaluated under field conditions, leading to the identification of heat-tolerant Zheng58 and heat-sensitive Qi319. The two inbred lines were exposed to controlled conditions of 30°C/20°C (optimal) and 42°C/30°C (heat stress) during the grain filling period. Heat stress significantly reduced thousand-kernel weight and seed setting rates, with Qi319 experiencing more pronounced declines. In contrast, Zheng58 showed superior performance, with a grain filling rate 48% higher and seed setting rate 57% greater than Qi319. Transcriptome analysis showed that heat stress d

SUBMITTER: Li X 

PROVIDER: S-EPMC11782181 | biostudies-literature | 2024

REPOSITORIES: biostudies-literature