Laser-Induced Nanowire Percolation Interlocking for Ultrarobust Soft Electronics.

ABSTRACT: Metallic nanowires have served as novel materials for soft electronics due to their outstanding mechanical compliance and electrical properties. However, weak adhesion and low mechanical robustness of nanowire networks to substrates significantly undermine their reliability, necessitating the use of an insulating protective layer, which greatly limits their utility. Herein, we present a versatile and generalized laser-based process that simultaneously achieves strong adhesion and mechanical robustness of nanowire networks on diverse substrates without the need for a protective layer. In this method, the laser-induced photothermal energy at the interface between the nanowire network and the substrate facilitates the interpenetration of the nanowire network and the polymer matrix, resulting

SUBMITTER: Jung Y 

PROVIDER: S-EPMC11785881 | biostudies-literature | 2025 Jan

REPOSITORIES: biostudies-literature