Organohydrogel Based Electronic Skin Reinforced by Dual-Mode Conduction and Hierarchical Collagen Fibers Skeleton.

ABSTRACT: Collagen fiber skeleton from animal skin is an ideal substrate for electronic skin (e-skin). However, the interface mismatch between conductive materials and skeleton and the monotonicity of conductive network still hinder its creation. Herein, a novel collagen fiber-based e-skin with dual-mode conduction of NaCl and conductive spheres (IECS) is accomplished by loading organohydrogel into the skeleton via "permeation and self-assembly". The resulting interpenetrating network produces a 3D continuous, conductive pathway and strong interface interaction with high-density hydrogen bonding, thus exhibiting excellent strength (24.5 MPa), conductivity (14.82 S m^-1), sensing performance (sensitivity of 16.64), and environmental stability. The physical structure (3D skeleton, interpenet

SUBMITTER: Guo R 

PROVIDER: S-EPMC11809366 | biostudies-literature | 2025 Feb

REPOSITORIES: biostudies-literature