Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique.

ABSTRACT: A wafer-scale metal self-rolled-up membrane platform has been proposed for the design and fabrication of radio-frequency on-chip lumped passive components, which is demonstrated on a commercial 4-inch sapphire batch fabrication line. Compared to the traditional methodology including planar or SiN_x based self-rolled-up membrane processing technologies to obtain the most basic passive lumped components, such as inductors and capacitors on the chip, this platform enables more compact three-dimensional construction of the component device structure with higher electrical performance. For demonstration, batches of wafer-scale RF inductors and capacitors are fabricated through precise design based on electromagnetic analysis. Measurement results show that radio-frequency inductor samp

SUBMITTER: Zhou Z 

PROVIDER: S-EPMC11907070 | biostudies-literature | 2025 Mar

REPOSITORIES: biostudies-literature