Low-dielectric benzocyclobutenyl polysiloxane resin: spatial structure design and photosensitive patterning performance.

ABSTRACT: With the development of miniaturization and the high integration of semiconductor devices, higher performance requirements are put forward for polymer photoresists. In this paper, a benzocyclobutene-based polysiloxane photosensitive resin was prepared by sol-gel method, which was well patterned and cured quickly after UV light curing, with a minimum line width and line spacing of 10 μm. The benign combination of benzocyclobutene group (BCB) and polysiloxane in the resin makes the resin exhibit good low dielectric properties (k = 2.79) and excellent thermal properties and mechanical properties, which is different from traditional thermosetting resins.

SUBMITTER: Peng J 

PROVIDER: S-EPMC11907431 | biostudies-literature | 2025 Mar

REPOSITORIES: biostudies-literature